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Higher Uniformity Thermal Oxide Wafer Excellent Dielectric Layer As An Insulator

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Higher Uniformity Thermal Oxide Wafer Excellent Dielectric Layer As An Insulator

Brand Name : ZG

Model Number : MS

Certification : CE

Place of Origin : CHINA

MOQ : 1 piece

Price : USD10/piece

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 10000 pieces per month

Delivery Time : 3 working days

Packaging Details : Strong wooden box for Global shipping

Application : integrated circuits , detector / sensor device , MEMS fabrication, opto-electronic components, and solar cells

Diameter : Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"

Oxide Thickness : 100 A ~ 6 um

Grade : Prime / Test / Dummy grade

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Thermal Oxide Wafer, higher uniformity, and higher dielectric strength , excellent dielectric layer as an insulator

Thermal oxide or silicon dioxide layer is formed on bare silicon surface at elevated temperature in the presence of an oxidant , the process is called thermal oxidation. Thermal oxide is normally grown in a horizontal tube furnace , at temperature range from 900°C ~ 1200°C , using either a "Wet" or "Dry" growth method . Thermal oxide is a kind of "grown" oxide layer , compared to CVD deposited oxide layer , it has a higher uniformity, and higher dielectric strength , it is an excellent dielectric layer as an insulator . In most silicon- based devices, thermal oxide layer play an important role to pacify the silicon surface to act as doping barriers and as surface dielectrics . we provides thermal oxide wafer in diameter from 2" to 12 " , we always choose prime grade and defect free silicon wafer as substrate for growing high uniformity thermal oxide layer to meet your specific requirements . Contact us for further information on price & delivery time .

Thermal Oxide Capability

Typically after thermal oxidation process , both front side and back side of silicon wafer have oxide layer . In case only one side oxide layer is required , we can remove back oxide and offer one side thermal oxide wafer for you .

Oxide thickness range Oxidation technique Within wafer
uniformity
Wafer to wafer
uniformity
Surface processed
100 Å ~ 500Å dry oxide +/- 5% +/- 10% both sides
600 Å ~ 1000Å dry oxide +/- 5% +/- 10% both sides
100 nm ~ 300 nm wet oxide +/- 5% +/- 10% both sides
400 nm ~ 1000 nm wet oxide +/- 3% +/- 5% both sides
1 um ~ 2 um wet oxide +/- 3% +/- 5% both sides
3 um ~ 4 um wet oxide +/- 3% +/- 5% both sides
5 um ~ 6 um wet oxide +/- 3% +/- 5% both sides

Thermal Oxide Wafer Application

100 A Tunneling Gates
150 A ~ 500 A Gate Oxides
200 A ~ 500 A LOCOS Pad Oxide
2000 A ~ 5000 A Masking Oxides
3000 A ~ 10000 A Field Oxides

Product Specification

Qxidation technique Wet oxidation or Dry oxidation
Diameter Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"
Oxide thickness 100 A ~ 6 um
Tolerance +/- 5%
Surface Single side or double sides oxide layer
Furnace Horizontal tube furnace
Gase Hydrogen and Oxygen gases
Temperature 900 C ° - 1200 C °
Refractive index 1.456

Higher Uniformity Thermal Oxide Wafer Excellent Dielectric Layer As An Insulator


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Higher Uniformity Thermal Oxide Wafer

      

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2" thermal oxide silicon wafer

      
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