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Brand Name : ZG
Model Number : MS
Certification : CE
Place of Origin : CHINA
MOQ : 1 piece
Price : USD10/piece
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 10000 pieces per month
Delivery Time : 3 working days
Packaging Details : Strong wooden box for Global shipping
Application : integrated circuits , detector / sensor device , MEMS fabrication, opto-electronic components, and solar cells
Diameter : Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"
Oxide Thickness : 100 A ~ 6 um
Grade : Prime / Test / Dummy grade
Thermal Oxide Wafer, higher uniformity, and higher dielectric strength , excellent dielectric layer as an insulator
Thermal oxide or silicon dioxide layer is formed on bare silicon surface at elevated temperature in the presence of an oxidant , the process is called thermal oxidation. Thermal oxide is normally grown in a horizontal tube furnace , at temperature range from 900°C ~ 1200°C , using either a "Wet" or "Dry" growth method . Thermal oxide is a kind of "grown" oxide layer , compared to CVD deposited oxide layer , it has a higher uniformity, and higher dielectric strength , it is an excellent dielectric layer as an insulator . In most silicon- based devices, thermal oxide layer play an important role to pacify the silicon surface to act as doping barriers and as surface dielectrics . we provides thermal oxide wafer in diameter from 2" to 12 " , we always choose prime grade and defect free silicon wafer as substrate for growing high uniformity thermal oxide layer to meet your specific requirements . Contact us for further information on price & delivery time .
Thermal Oxide Capability
Typically after thermal oxidation process , both front side and back side of silicon wafer have oxide layer . In case only one side oxide layer is required , we can remove back oxide and offer one side thermal oxide wafer for you .
Oxide thickness range | Oxidation technique | Within wafer uniformity | Wafer to wafer uniformity | Surface processed |
---|---|---|---|---|
100 Å ~ 500Å | dry oxide | +/- 5% | +/- 10% | both sides |
600 Å ~ 1000Å | dry oxide | +/- 5% | +/- 10% | both sides |
100 nm ~ 300 nm | wet oxide | +/- 5% | +/- 10% | both sides |
400 nm ~ 1000 nm | wet oxide | +/- 3% | +/- 5% | both sides |
1 um ~ 2 um | wet oxide | +/- 3% | +/- 5% | both sides |
3 um ~ 4 um | wet oxide | +/- 3% | +/- 5% | both sides |
5 um ~ 6 um | wet oxide | +/- 3% | +/- 5% | both sides |
Thermal Oxide Wafer Application
100 A | Tunneling Gates |
150 A ~ 500 A | Gate Oxides |
200 A ~ 500 A | LOCOS Pad Oxide |
2000 A ~ 5000 A | Masking Oxides |
3000 A ~ 10000 A | Field Oxides |
Product Specification
Qxidation technique | Wet oxidation or Dry oxidation |
---|---|
Diameter | Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12" |
Oxide thickness | 100 A ~ 6 um |
Tolerance | +/- 5% |
Surface | Single side or double sides oxide layer |
Furnace | Horizontal tube furnace |
Gase | Hydrogen and Oxygen gases |
Temperature | 900 C ° - 1200 C ° |
Refractive index | 1.456 |
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Higher Uniformity Thermal Oxide Wafer Excellent Dielectric Layer As An Insulator Images |